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Here's our current selection of white papers. Product related Application Notes can be found in support.

Overcoming the Top 5 Challenges of Harmonic Measurements

Electromagnetic regulations require verification of emissions compliance of all wireless products. Current wireless technology has pushed the limits of semiconductor capabilities to the point where there is little margin between typical emissions and regulatory limits. To guarantee compliance, it is often essential to measure emissions on a unit-by-unit basis in production. This white paper details several of the key challenges involved and presents a newly available, cost-effective approach to harmonic measurement.

A System Architect's Guide to the MIPI-RFFE Bus and Its Capabilities

Emerging radio technologies such as 5G cellular and 802.11ax have pushed download speeds into the Gigabit-per-second range and latencies in single-digit milliseconds. It is not uncommon to find products incorporating these, and several other, highly complex radios into a single package. For system engineers, overcoming packaging constraints while maintaining radio radio performance is becoming increasingly difficult. To help address some of these difficulties, the MIPI RF Front-End (RFFE) specification was introduced to provide a highly efficient but flexible control interface for these systems.

Introduction to the CPRI Specification and the 5G Evolution to eCPRI

Every generation of mobile network brings about new technology and infrastructure improvements to support faster data rates, greater bandwidth, and improved efficiency and coverage. To keep up with these advancements, base station architectures have steadily evolved over time. The introduction of fourth generation cellular (4G) required major changes in the traditional analog radio architecture, such as the migration of all analog circuitry to the remote radio unit (RRU).

An Overview of the MIPI-I3C Serial Interface and It’s Impact on New Designs

In recent years, the electronics industry has experienced an explosion in the growth of embedded sensors being used in high-volume applications such as smartphones, wearables, automobiles, and the Internet of Things (IoT). This rapid growth is fueled by the development of a wide variety of small-sized, low-cost sensors being married to an ever-expanding array of innovative consumer applications. An excellent example is today’s typical smartphone, which incorporates 10 or more sensors measuring anything from light and biometric response to motion and environmental conditions. To address these market needs, the MIPI I3C Standard was developed specifically to address connectivity between sensors and a host processor in mobile, wearable, and IoT applications.